Description
The ultimate drop-in gaming upgrade for the AM4 platform
Built for gamers and creators who want to extract maximum performance from their existing systems, this processor fits directly into the mature AM4 socket. It eliminates the need for a complete platform rebuild, allowing users to retain their current motherboard and up to 128 GB of DDR4-3200 memory. This makes it a highly efficient upgrade path that bypasses the high costs associated with transitioning to newer motherboard sockets and DDR5 memory modules.
Massive 96MB L3 cache built for high-framerate gaming
The defining feature of this 8-core, 16-thread processor is its total cache capacity of 100 MB, which includes 96MB of L3 cache and 4MB of L2 cache. Built on the 7nm Zen 3 architecture, the processor operates at a base clock speed of 3.4 GHz and can boost up to 4.5 GHz when thermal headroom allows. By stacking the L3 cache vertically, AMD has expanded the on-chip storage capacity without increasing the physical footprint of the 74 mm² CPU compute die. This massive cache pool allows the processor to handle complex physics, AI calculations, and high-framerate rendering instructions with minimal delay.
Efficient 105W TDP paired with Carbice Ice Pad thermal interface
Operating with a TDP of 105W, the processor manages power delivery and heat dissipation efficiently across its dual-die package layout, which pairs the 7nm compute die with a 12nm, 125 mm² I/O die. While a CPU cooler is not included, the processor features a Carbice Ice Pad thermal solution. This high-performance thermal pad replaces traditional thermal paste, providing consistent heat transfer to your chosen aftermarket cooler and helping to keep operating temperatures well below the maximum limit of 90°C.
Direct integration with existing DDR4 memory and PCIe 4.0 systems
The processor features 24 PCIe 4.0 lanes, providing high-bandwidth connectivity for modern graphics cards and rapid NVMe storage drives. It supports dual-channel DDR4 memory configurations with official speeds up to DDR4-3200, and includes ECC (Error-Correcting Code) memory support for enhanced system stability where compatible motherboards are used. This processor is fully optimised for Windows 11 gaming environments and carries the AMD Ryzen VR-Ready Premium tier, ensuring compatibility with demanding virtual reality hardware and software configurations.
Three-year warranty and proven Zen 3 endurance
With 8.85 billion transistors integrated across its architecture, this processor is built for long-term reliability. AMD backs this 10th Anniversary Edition processor with a 3-year warranty, giving you peace of mind for your system upgrade. Note that the multiplier is locked on this model, as the 3D V-Cache technology is pre-optimised for maximum performance and voltage stability out of the box.
| Architecture | Zen 3 (Vermeer) |
|---|---|
| Process Node | 7 nm |
| Cores | 8 |
| Threads | 16 |
| Base Clock | 3.4 GHz |
| Boost Clock | 4.5 GHz |
| L1 Cache | 512 KB |
| L2 Cache | 4 MB |
| L3 Cache | 96 MB |
| Total Cache | 100 MB |
| TDP | 105 W |
| Socket | AM4 |
| Memory Support | DDR4-3200 |
| Max Memory Capacity | 128 GB |
| Memory Channels | 2 |
| ECC Support | Yes |
| PCIe Version | PCIe 4.0 |
| PCIe Lanes | 24 |
| Integrated Graphics | None |
| Unlocked Multiplier | No |
| Cooler Included | No |
| Thermal Solution | Carbice Ice Pad |
| Max Operating Temperature | 90°C |
| Transistors | 8.85 Billion |
| CPU Compute Die Size | 74 mm² |
| I/O Die Size | 125 mm² |
| Package Die Count | 2 |
| I/O Die Process Node | 12 nm |
| Supported Technologies | AMD 3D V-Cache Technology, Windows 11 Gaming, AMD Ryzen VR-Ready Premium |
| Warranty | 3 Years |
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